Among the AEC industry’s most powerful tools are digital technologies, from parametric modeler software to environmental analysis programs. Neil Thelen (Diller Scofidio + Renfro), Gordon Gill (Adrian Smith + Gordon Gill Architecture), Edward Peck (Thornton Tomasetti), and Doris Sung (dO/Su Studio) took time out from April’s facades+ NYC conference to talk to our partners at Enclos about how technology is shaping the future of envelope design.

At next month’s facades+ Chicago conference, a series of tech workshops will offer hands-on instruction in topics including facade panelization and optimization and collaborative design and analysis. For more information or to register, visit the conference website.